AP-14 Thermal Pad offers exceptional 16.8W/m·K thermal conductivity for efficient heat transfer between chips and heat sinks. Ideal for CPUs, GPUs, power modules, and LED applications. Reliable, durable, and customizable for OEM/ODM projects.
| Product Name | AP-14 thermal pad |
| Operating Temperature | -50 °C+250°C |
| Hardness | 30~55 Sc |
| Material | Silicone thermal material |
| Application | Memory chips (VRAM/GDDR)Motherboard componentsSSD/M.2 drivesIntegrated circuits (lCs), etc |
| Thermal conductivity | 16.8W/mk |
| Color | Pink |
| Size | 120MM * 120MM / 85MM * 45MM / 120MM * 20MM |
| Thickness | 0.5MM/1MM/1.5MM/2MM/2.5MM/3MM |
| Certifications | RoHS, REACH, ISO |
